Application: 1.Heat dissipation of electronic appliances, power supply, bonding of transistors. 2.Thermistor heat-dissipating sealing, PTC bonding insulation. 3.Adhesive sealing and heat dissipation with high thermal conductivity. 4.Bonding and sealing of high-power LEDs and lamp beads. 5.Household appliances, electronic components, electricians. Specification: Specific quantity: [ 25 ° C (770 F)] > 2.3 Heat transfer coefficient: W/m-k >0.975 Thermal impedance: c-in/W <0.246 Arc resistance: seconds 120 Dry time: [25 °C] 5~15min Bonding strength: 1.8Mpa Insulation coefficient: 100Hz/Kvac 5.1 1000Hz/Kvac 5.0 Notes: 1.When using, directly extrude the product, rub it with the surface of the adherend, and cover it immediately after use, in case of trial again; 2.The surface fixed speed is related to the relative humidity and temperature in the air; higher temperature, faster curing speed, and vice versa; 3.The recommended thickness of the application: 0.1-0.5mm, the thinner the better; 4.Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean. Package includes: 3 x Thermal Glue

• Quickly solidifies after exposure to air. Dry time: [25 °C] 5~15min
• After-sales guarantee: each defective item can be replacement for free or refund. If any question, please feel free to contact or QA us, we will try our best to service you

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