
Description Solder Paste in jar 50g (T3) Sn63/Pb37 no clean 90.25% metal. Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 90.25% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 183C (361F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
| Brand Name | Chip Quik |
| Manufacturer | Chip Quik® |
| Item Type | Solder Fluxes · Home Improvement |
| Shipping Weight | 41 g |
| Package Dimensions | 5 × 5 × 3.2 cm |
| Category | Home Improvement › Power & Hand Tools › Power Tool Accessories › Soldering Accessories › Solder, Fluxes and Pastes › Solder Fluxes |
| Category Rank | #226,654 in Home Improvement |
| Marketplace Rating | 4.6 out of 5 (475 ratings on the source marketplace) |
| EAN | 0700254127156 |
| UPC | 700254127156 |
| Attributes | Chip Quik SMD291AX50T3 Solder… · Made with Sn63/Pb37 alloy:… |



