The phase-change material on which the PhaseSheet PTM is based is solid at room temperature. The material only begins to liquefy at temperatures above 45 degrees Celsius. A high contact pressure of around 300-400N is required for optimum distribution of the liquid PhaseSheet PTM and thus the lowest possible layer thickness. PhaseSheet PTM has a very low viscosity in its liquid state and contracts again when it changes to a solid material, thus minimizing the pump-out effect. The pump-out effect is particularly pronounced when combining a copper cooler on a graphics chip because silicon and copper have different linear expansion when heated. The temperatures under load cause the heatspreader and the base plate to deform (concave or convex) and return to their original shape (straight) when they cool down. As a result, the thermal paste is slowly pressed out between the heatspreader and the base plate of the CPU cooler, for example. Outstanding thermal conductivity Consistently high performance Very long service life Versatile in application Not electrically conductive Easy to use PhaseSheet PTM is more durable than traditional thermal pastes, but not as durable as KryoSheet, for example, which is virtually maintenance-free. PhaseSheet PTM develops and stabilizes its maximum thermal conductivity after around ten thermal cycles above 60 degrees Celsius. Scope of Delivery 1x PhaseSheet PTM

• Very low viscosity in liquid state for minimal layer thickness
• Reduced pump-out effect due to contraction during solidification
• Non-electrically conductive - safe for sensitive electronics
• Long-lasting performance with stable thermal conductivity after approx. 10 thermal cycles
• Versatile use in various cooling systems
• Easy handling and application

Specifications

Common questions