Thermal Grizzly TG Putty Advance is an electrically non-conductive alternative to traditional thermal pads, specifically designed for GPU modifications and the replacement of thermal pads between the PCB and cooler. As an easily applicable and flexible gap filler, it compensates for height differences, making it ideal for replacing thermal pads on graphics cards. Typically, multiple types of thermal pads with varying heights are used in factory settings; TG Putty simplifies this by adapting to different component heights. Application can be done using the included spatulas for broad coverage or by hand (gloves recommended) by forming small beads tailored to the target surface, such as VRAM or SMD components. TG Putty effectively bridges height differences from 0.2 mm to 3.0 mm. It is available in three variants—Basic with moderate thermal conductivity, Advance with good thermal conductivity, and Pro with very good thermal conductivity—to cater to diverse cooling requirements. Before application, ensure that the target surface is thoroughly cleaned and degreased, using TG Cleaning Wipes or standard isopropanol, to achieve optimal results.

• Effectively bridges height differences ranging from 0.2 mm to 3.0 mm for versatile use across various components.
• Available in three variants—Basic, Advance, and Pro—offering different levels of thermal conductivity to suit specific needs.
• Basic variant provides moderate thermal conductivity, suitable for standard cooling requirements.
• Advance variant offers improved thermal conductivity for enhanced heat dissipation.
• Pro variant delivers superior thermal conductivity, ideal for high-performance cooling solutions.
• Each package includes three spatulas for convenient and precise application.

Specifications

Common questions